Tomen Joins Intel's Beijing R&D Facility to Deliver Next Generation I/O Technology

2003-04-22

Tomen Joins Intel's Beijing R&D Facility to Deliver Next Generation I/O Technology Testing to Lead Users of Intel Architecture Server Platforms

Tomen Corporation announced today it is joining forces with Intel Corporation to provide leading-edge users of technology in China with testing facilities to evaluate emerging interconnect standards for use on Intel architecture server platforms. Tomen is supplying Intel's I/O (Input and Output) Interconnect Labs - part of Intel's Research and Development center in Beijing - with switching infrastructure solutions that enable 10 Gbps communication between servers at latency levels that are ideal for database clustering and high performancecomputing applications.

These systems deliver Agilent Technologies' 10Gbps integrated circuit (IC) technology embedded in InfiniCon Systems' next generation high speed interconnect system for Intel architecture server platforms. Intel, the world's largest chipmaker, is also a leading manufacturer of computer, networking and communication products. The first lab, located at Intel's Beijing R&D facility, is a joint effort between Tomen and Intel.

Initial technology configurations offered in the Interconnect Lab will focus on Intel architecture server clustering solutions featuring InfiniBandTM architecture. InfiniBand architecture has emerged as a leading clustering technology with multiple data centers in initial deployment of the technology in China. Currently the lab features InfiniBand technology products such as ASIC/controller technology from Agilent, and shared I/O and clustering technology from InfiniCon Systems, to provide the intelligent fabric for users to build multi-node, InfiniBand-based server clustersthat can also connect into storage and communication networks.

"InfiniBand technology on Intel architecture sever platforms enables Tomen to introduce confidently next-generation networking capabilities to our customers in China and Japan, offering them higher performance levels and the infrastructure they will need to support operations", said Morihiko Tashiro, President of Tomen Corporation. He continued, "China is the world's fastest growing nation in terms of spending on information and communication technology. Our relationship with Intel positions us to establish an early foothold on the initial opportunities in the Chinese market."

"Customers have shown an acute interest in testing the latest I/O technology on Intel architecture server platforms," said Jim Pappas, director of initiative marketing for Intel's Enterprise Platform Group. "With new enterprise interconnects including InfiniBand architecture and PCI Express technology becoming available on our server platforms over the next year there is a need for lead users to have an easy access point to testing our latest server clustering configurations. We're pleased to work with Tomen to deliverthe first I/O Interconnect Lab in Beijing."

Tomen is playing an important role to promote the InfiniBand solution in Japan and China. Tomen provides a "one-roof-solution" from IC to system components to major server platform venders including Fujitsu,NEC and Langchao.

In July 2002, Tomen and the RedSwitch Division of Agilent Technologies, Inc. (formerly RedSwitch Inc.) signed a distribution agreement of high performance InfiniBand switch ASICs (Application Specific Integrated Circuits) and solutions, and in conjunction with the solutions, entry into the high performance computing and storage system market in Japan and China. By the agreement, Tomen entered the market of growing high performance systems in Japan and China through distribution of the entire line of InfiniBand related solutions. RedSwitch's solution is designed to be fully compliant with the InfiniBand Trade Association'sstandard.

In February 2003, Tomen announced a strategic agreement with InfiniCon Systems of Pennsylvania, U.S.A., the premier provider of shared I/O and switching solutions for next-generation server networks. As a result, Tomen will distribute InfiniCon's InfinIO 7000TM family of InfiniBand switching and shared I/O solutions -- which includes the software stack needed to enable and optimize clustering applications -- to computer and storage companies in the Chineseand Japanese markets.

Contact:
Tsutomu Mori
Assistant General Manager
IB Solution Business Unit
Electronics and Information Department
Tomen Corporation
Phone:81-3-5288-2735
Fax: 81-3-5288-9143
E-mail: tsutomu_mori@tomen.com

About Tomen Corporation
Tomen is an international company with 80 offices worldwide and is headquartered in Japan. It is listed on the Tokyo, Osaka and Nagoya stock exchanges. It maintains a leadership position in foodstuffs, textiles, electronics and computer networking equipment, chemicals, energy and plant project business fields, where it seeks to provide innovative services to its customers and business partners. Tomen Group's Tomen Electronics (www.tomen-ele.co.jp) and Shanghai Hong Ri International Electronics Co., Ltd., are the leadingdistributors of semiconductors in Japan and China.

About Intel Corporation ( www.intel.com/press room )
Intel Corporation (INTC) is the world's largest chipmaker and a leadingmanufacturer of computer, networking and communications products.

About Agilent Technologies Inc. ( www.agilent.com )
Agilent Technologies Inc. (NYSE:A) is a global technology leader in communications, electronics and life sciences. The company's 35,000 employees serve customers in more than 110 countries. Agilent had net revenues of $6 billion in fiscal year 2002.

About InfiniCon Systems, Inc. ( www.infinicon.com )
InfiniCon is the premier provider of shared I/O and switching solutions for next-generation server networks. The company is an active member of the InfiniBand Trade Association, the Storage Network Industry Association, the Direct Access File System (DAFS) Collaborative, and the Server Blade Trade Association.

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